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TISP2310L
DUAL SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
Copyright © 1997, Power Innovations Limited, UK
FEBRUARY 1990 - REVISED SEPTEMBER 1997
TELECOMMUNICATION SYSTEM SECONDARY PROTECTION
q
Ion-Implanted Breakdown Region
Precise and Stable Voltage
Low Voltage Overshoot under Surge
DEVICE
‘2310L
V
(Z)
V
250
V
(BO)
V
310
q
Planar Passivated Junctions
Low Off-State Current < 10 µA
Rated for International Surge Wave Shapes
WAVE SHAPE
8/20 µs
10/160 µs
10/560 µs
0.2/310 µs
10/700 µs
10/1000 µs
STANDARD
ANSI C62.41
FCC Part 68
FCC Part 68
RLM 88
FTZ R12
VDE 0433
CCITT IX K17/K20
REA PE-60
I
TSP
A
150
60
45
38
50
50
50
50
q
device symbol
q
UL Recognized, E132482
description
The TISP2310L is designed specifically for
telephone equipment protection against lightning
and transients induced by a.c. power lines.
These devices will supress voltage transients
between terminals A and C, B and C, and A and
B.
Transients are initially clipped by zener action
until the voltage rises to the breakover level,
which causes the device to crowbar. The high
crowbar holding current prevents d.c. latchup as
the transient subsides.
These monolithic protection devices are
fabricated in ion-implanted planar structures to
ensure precise and matched breakover control
and are virtually transparent to the system in
normal operation.
PRODUCT
INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
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TISP2310L
DUAL SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
FEBRUARY 1990 - REVISED SEPTEMBER 1997
absolute maximum ratings at
25°C
case temperature (unless otherwise noted)
RATING
Non-repetitive peak on-state pulse current (see Notes 1, 2 and 3)
8/20 µs (ANSI C62.41, open-circuit voltage wave shape 1.2/50 µs)
10/160 µs (FCC Part 68, open-circuit voltage wave shape 10/160 µs)
5/200 µs (VDE 0433, open-circuit voltage wave shape 2 kV, 10/700 µs)
0.2/310 µs (RLM 88, open-circuit voltage wave shape 1.5 kV, 0.5/700 µs)
5/310 µs (CCITT IX K17/K20, open-circuit voltage wave shape 2 kV, 10/700 µs)
5/310 µs (FTZ R12, open-circuit voltage wave shape 2 kV, 10/700 µs)
10/560 µs (FCC Part 68, open-circuit voltage wave shape 10/560 µs)
10/1000 µs (REA PE-60, open-circuit voltage wave shape 10/1000 µs)
Non-repetitive peak on-state current, 50 Hz, 0.7 s (see Notes 1 and 2)
Initial rate of rise of on-state current,
Junction temperature
Operating free - air temperature range
Storage temperature range
Lead temperature 1.5 mm from case for 10 s
T
stg
T
lead
Linear current ramp, Maximum ramp value < 38 A
I
TSM
di
T
/dt
T
J
I
TSP
150
60
50
38
50
50
45
50
10
250
150
0 to 70
-40 to +150
260
A rms
A/µs
°C
°C
°C
°C
A
SYMBOL
VALUE
UNIT
NOTES: 1. Above 70°C, derate linearly to zero at 150°C case temperature
2. This value applies when the initial case temperature is at (or below) 70°C. The surge may be repeated after the device has
returned to thermal equilibrium.
3. Most PTT’s quote an unloaded voltage waveform. In operation the TISP essentially shorts the generator output. The resulting
loaded current waveform is specified.
.
electrical characteristics for the A and B terminals, T
J
= 25°C
PARAMETER
V
Z
I
D
C
off
NOTE
Reference zener
voltage
Off-state leakage
current
Off-state capacitance
I
Z
=
±
1mA
V
D
=
±
50 V
V
D
=
0
f = 1 kHz
(see Note 4)
40
TEST CONDITIONS
MIN
±
250
±
10
100
TYP
MAX
UNIT
V
µA
pF
4: These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The third terminal is
connected to the guard terminal of the bridge.
electrical characteristics for the A and C or the B and C terminals, T
J
= 25°C
PARAMETER
V
Z
V
Z
Reference zener
voltage
Temperature coefficient
of reference voltage
Breakover voltage
Breakover current
Peak on-state voltage
Holding current
Critical rate of rise of
off-state voltage
Off-state leakage
current
Off-state capacitance
(see Notes 5 and 6)
(see Note 5)
I
T
=
±
5 A
(see Note 5)
(see Note 7)
V
D
=
±
50 V
V
D
= 0
f = 1 kHz
(see Note 4)
110
(see Notes 5 and 6)
±
150
±
5
±
10
200
±
0.15
±
2.2
I
Z
=
±
1mA
TEST CONDITIONS
MIN
±
250
0.1
±
310
±
0.6
±
3
TYP
MAX
UNIT
V
%/
o
C
V
A
V
mA
kV/µs
µA
pF
V
(BO)
I
(BO)
V
TM
I
H
dv/dt
I
D
C
off
NOTES: 5. These parameters must be measured using pulse techniques, t
w
= 100
µs,
duty cycle
2%.
6. These parameters are measured with voltage sensing contacts seperate from the current carrying contacts located within 3.2 mm
(0.125 inch) from the device body.
7. Linear rate of rise, maximum voltage limited to 80 % V
Z
(minimum)..
PRODUCT
INFORMATION
2
TISP2310L
DUAL SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
FEBRUARY 1990 - REVISED SEPTEMBER 1997
PARAMETER MEASUREMENT INFORMATION
Figure 1. VOLTAGE-CURRENT CHARACTERISTIC FOR ANY PAIR OF TERMINALS
The high level characteristics for terminals A and B are not guaranteed.
thermal characteristics
PARAMETER
R
θ
JA
Junction to free air thermal resistance
MIN
TYP
MAX
100
UNIT
°C/W
PRODUCT
INFORMATION
3
TISP2310L
DUAL SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
FEBRUARY 1990 - REVISED SEPTEMBER 1997
MECHANICAL DATA
SOT-82
3-pin plastic single-in-line package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SOT-82
7,8
7,4
2,7
2,4
10,8
10,5
Exposed
Heat Slug
2,54 typ
0,9
0,7
15,7 typ
1
2
3
2,2 typ
1,2 typ
0,75
0,49
4,4 typ
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: The centre pin is in electrical contact with the heat slug.
MDXXAQ
PRODUCT
INFORMATION
4
TISP2310L
DUAL SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
FEBRUARY 1990 - REVISED SEPTEMBER 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright © 1997, Power Innovations Limited
PRODUCT
INFORMATION
5
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